Field Service Engineer-Chinese Bilingual
Field Service Engineer is responsible for equipment installation, maintenance, modification of equipment in the field, sales of
maintenance parts and troubleshooting
The secondary responsibility is developing, optimizing, yield improvement, process integration, and customer technical support, and sustaining fan-out wafer level packaging (FOWLP) processes.
Role Weighting
Process Engineering: Approximately 10-20%
Field Service Engineering: Approximately 80-90%
Key Responsibilities
Field Service Engineering (Primary Responsibility)
Equipment Installation & Maintenance
Support installation, setup, and qualification of backend equipment
Perform and support FAT/SAT and customer acceptance testing
Execute preventive and corrective maintenance as needed
Discussion about specification of modification of equipment in the field.
Sales activities of maintenance parts
Equipment Troubleshooting & Escalation Support
Troubleshoot mechanical, electrical, pneumatic, vacuum, and software issues of equipment, wafer handling robots, aligners, EFEM and new products that TAZMO Japan develops and market in the future.
Diagnose process-induced tool issues and coordinate resolution
Support tool calibration, recipe setup, and tool matching
Documentation & Feedback
Prepare service reports, RCA documentation, and customer communications
Provide structured feedback to engineering teams for tool and process improvement
Propose maintenance contract
Prepare specification sheet of equipment
Process Engineering
FOWLP Process Development & Optimization
Setup demo environment and an office in Arizona
Develop new businesses by conducting demonstrations
Develop, qualify, and optimize process, including Temporary
carrier bonding and debonding
Optimization of process
Lead DOE, SPC analysis, and yield improvement initiatives
Customer & Cross-Functional Technical Support
Serve as the primary technical interface for process-related topics
Support customer process integration, NPI, and ramp to HVM
Collaborate with product, equipment, quality, and R&D teams
Support customer technical reviews, audits, and escalations
Others
Other general duties are based on projects or particular assignments as needed
Required Qualifications
Education
Bachelor or master degree in:
o Materials Science
o Electrical Engineering
o Chemical Engineering
o Mechanical Engineering
Experience
5–10 years of experience in:
o Semiconductor backend process engineering, and
o Advanced packaging or wafer-level packaging environments
Hands-on experience with FOWLP processes and manufacturing
equipment
Technical Skills
Experience with:
o Backend process of semiconductor
o SPC, DOE, Cp/Cpk analysis
o Failure analysis and yield modeling
o Cleanroom and HVM environments
Ability to read and interpret:
o Electrical schematics
o Mechanical drawings
o Pneumatic and vacuum diagrams
Preferred Qualifications
Experience supporting backend factories
Knowledge of PLC
Familiarity with power devices, AI/HPC packaging requirements
Prior field service or customer-facing engineering experience
Knowledge of slit die coating
Soft Skills
Strong analytical and structured problem-solving skills
Excellent customer-facing communication abilities
Ability to work independently at customer sites
High level of ownership, accountability, and technical credibility
Ability to communicate in traditional Chinese
Misc.
This job description is not an employment contract.
This job description may be revised each year or as business needs dictate. Also, the description may be subject to change at management's discretion at any time.
The job description does not constitute any assurance or guarantee of employment. The employee’s employment by the Company is understood as “Employment-at-Will.
Ability to routinely lift, pull, or push objects, up to 50 pounds with or without accommodation.